Keynote Speakers

Yimao Cai
Professor
Peking University, China

Prof. Cai is a Boya Distinguished Professor and PhD supervisor at Peking University, the recipient of the National Science Fund for Distinguished Young Scholars and the Ministry of Education’s Changjiang Young Scholars Program. He has been engaged in research on advanced semiconductor devices and integration, memory technologies, and brain-inspired chip technologies for many years. He has led multiple national projects, including the National Key R&D Program and the National Natural Science Foundation’s Key Program. He has published over 100 academic papers in international conferences and journals, including IEDM, EDL, TED, DAC, TCAD, etc., and holds more than 70 Chinese patents and over 10 U.S. patents. He serves as the vice chairman of the China Memory Industry Alliance, Executive Director of the Beijing Semiconductor Industry Association, and Editorial Board Member of journals such as Science China, Journal of Electronics, and Chip .

Scalable RRAM Technology for Advanced Memory and Intelligent Computing

Resistive random-access memory (RRAM) is a promising technology for advanced memory and intelligent computing due to its nonvolatile resistive states, CMOS compatibility, and in-memory computing capability. Scalable deployment requires coordinated device-to-system co-design under variability, reliability, and integration constraints.
This report presents scalable RRAM technologies for memory and computing. For memory, a progressive framework spans physical switching models, compact cell architectures, multi-level programming, and array-level reliability optimization, enabling controllable and dense resistive-state engineering. For computing, RRAM-based operators are discussed from linear matrix-vector multiplication to higher-order, hybrid-domain computation and reconfigurable mask-based architectures for neural, scientific, and multimodal edge intelligence.
A cross-layer design methodology toward edge AI systems is highlighted, requiring co-optimization across modeling, devices, arrays, and circuits with application-driven operator design.

Yang Chai
Professor
The Hong Kong Polytechnic University, China

Prof. Yang Chai is the Chair Professor of Semiconductor Physics of the Hong Kong Polytechnic University. He is an IEEE Distinguished Lecturer, an IEEE Fellow, an Optica Fellow, IOP Fellow, and AAIA Fellow. He is the Director of Research Institute for Artificial Intelligence of Things, the Director of Joint Research Center of Microelectronics, and the Associate Dean of Faculty of Science (Research) at the Hong Kong Polytechnic University. He is also the Chair of Semiconductor Nanotechnology Alliance, the Vice President of the Physical Society of Hong Kong, and an Associate Editor of ACS Nano. He is a receipt of the Falling Walls Science Breakthroughs in Engineering and Technology for his work on “Breaking the Wall of Efficient Sensory AI Systems”, the BOCHK Science and Technology Innovation Prize in the field of AI and Robotics, The Croucher Senior Fellowship, The Ho Leung Ho Lee Foundation Science and Technology Innovation Award, and NSFC Distinguished Scholar. His current research interest mainly focuses on emerging electronic devices.

Bioinspired In-Sensor Computing for Artificial Vision

The demand for accurate perception of the physical world leads to a dramatic increase in sensory nodes. However, the transmission of massive and unstructured sensory data from sensors to computing units poses great challenges in terms of power‐efficiency, transmission bandwidth, data storage, time latency, and security. To efficiently process massive sensory data, it is crucial to achieve data compression and structuring at the sensory terminals. In‐sensor computing integrates perception, memory, and processing functions within sensors, enabling sensory terminals to perform data compression and data structuring. We will overview optoelectronic intelligence for bioinspired in-sensor computing in artificial vision. We will examine optoelectronic devices that can compress and structure multidimensional vision information, and demonstrate a few vision sensors for different scenarios, including visual adaptation, motion perception, as well as event-driven vision sensors for spiking neural network.

Tibor Grasser
Professor
TU Wien, Austria

Prof. Tibor Grasser is an IEEE Fellow and head of the Institute for Microelectronics at TU Wien. He has edited various books, e.g. on the bias temperature instability, hot carrier degradation, and low-frequency noise (all with Springer), is a distinguished lecturer of the IEEE EDS, has been involved in outstanding conferences such as IEDM (General Chair 2021), IRPS, SISPAD, ESSDERC, and IIRW, is a recipient of the Best and Outstanding Paper Awards at IRPS (2008, 2010, 2012, and 2014), IPFA (2013 and 2014), ESREF (2008) and the IEEE EDS Paul Rappaport Award (2011). He served as an Associate Editor for IEEE T-ED and Microelectronics Reliability (Elsevier).

Benchmarking Insulators for Devices Based on 2D Materials

Despite major progress in 2D electronic devices, their predicted performance remains largely unrealized, partly because scalable insulators compatible with 2D materials are still lacking. Unlike SiO2 for silicon, no insulating material has yet enabled commercially competitive 2D transistor technology.

Identifying suitable insulators is a central challenge for 2D nanoelectronics, especially as sub-10 nm channel scaling requires gate insulators with sub-1 nm equivalent oxide thickness (EOT). To support competitive device performance, these insulators must combine low gate leakage, low interface and border trap densities, and high dielectric strength.

Current candidates include conventional amorphous 3D oxides, native 2D oxides, layered 2D crystals such as hBN and mica, and ionic 3D crystals such as CaF2 and related fluorides. However, each class has limitations: 3D oxides form poor interfaces and contain border traps; native oxides often suffer from non-stoichiometry, limited stability, and narrow bandgaps; hBN offers excellent interfaces but insufficient dielectric performance for sub-1 nm EOT; and other 2D insulators remain difficult to scale. In addition, vdW gaps and dead layers introduce additional penalties in terms of EOT which severly limit the scalability of some materials. This talk reviews the state of the art, key challenges, and possible solutions.

Jun He
Dr.
Wuhan University, China

He Jun, professor/doctoral supervisor, winner of the National Outstanding Youth Fund, young and middle-aged science and technology leader of the Ministry of Science and Technology, candidate of the “Ten Thousand Talents Program” of the Central Organization Department, chief scientist of the National Key Research and Development Program.

He serves as Chairman of the 2D Materials Branch and Vice Chairman of the Nanomaterials and Devices Branch of the Chinese Materials Research Society (CMRS). He also holds the position of Editor-in-Chief of Frontiers of Physics, and Associate Editor of Science Bulletin and Materials Today Chemistry.

Professor He has long been committed to research on novel low-dimensional semiconductor materials and their applications in electronic and optoelectronic devices. He has published over 200 papers in top international journals including Science, with more than 20,000 non-self citations, and holds over 30 granted patents.

He has received the First Prize of Natural Science Award from the Ministry of Education of China, the First Prize of Beijing Natural Science Award, the First Prize of Hubei Provincial Natural Science Award, the First Prize of Science and Technology Award from the Chinese Materials Research Society, and the First Prize of Innovation Award under the Invention & Entrepreneurship Award from the China Invention Association. He is also a recipient of the Frontiers of Materials Science Award (FMSA) conferred by the International Union of Materials Research Societies (IUMRS).

Wafer-Scale Two-Dimensional Semiconductor Materials and Post-Moore Information Devices

Integrated circuit materials and technologies constitute a major national strategic development priority. The International Roadmap for Devices and Systems (IRDS) indicates that post-Moore chips beyond 2030 will mainly rely on two-dimensional (2D) semiconductor material systems, and their wafer-scale fabrication and heterogeneous integration are critical to achieving this goal. To date, both intrinsically layered and non-layered materials can be prepared into corresponding 2D forms. Developing electronic devices with new principles and novel structures by leveraging the quantum properties of 2D electronic materials, and exploring their integrated applications with silicon-based devices, has become a prominent research focus. In this report, I will concentrate on the following aspects: (1) In materials research, we have pioneered the wafer-scale single-crystal synthesis and precise doping of various key 2D semiconductors including MoS2, WSe2 and Te, established a novel technical system for 2D van der Waals epitaxial growth, and extended this approach to non-van der Waals 2D materials such as GaN, lead salts, room-temperature magnetic semiconductors and multiferroics. The obtained materials deliver carrier transport velocities beyond those of silicon-based CMOS devices and enable high-performance broadband photodetection[1,8,10]. (2) In device engineering, we have innovatively proposed van der Waals intercalation technology and atomically precise gap engineering, realizing precise control over the interlayer spacing of 2D semiconductors and effective suppression of surface/interface defect states in devices. We have revealed the microscopic mechanisms of surface/interface contact and coupling in 2D semiconductors, and developed novel device fabrication strategies for advanced process nodes, including three-dimensional bump contacts and the development of new 2D single-crystal gate dielectrics[3,6,7,9]. (3) In system integration, we have developed key processes for the large-scale integration of 2D semiconductors, realizing vertically architectured multilayer interconnected CMOS logic circuits and post-Moore three-dimensional integrated chips with high device yield and performance. We have also demonstrated optoelectronic integrated devices with novel architectures and “all-in-one” multifunctional heterogeneously integrated devices, whose performance metrics represented the highest reported values at that time[2,4,5,11].

Acknowledgement

This work was supported by the National Natural Science Foundation of China (92464303 and U23A20364).

References

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    [7] C. Liu, X. Zou*, Y. Lv, X. Liu, C. Ma, K. Li, Y. Liu, Y. Chai, L. Liao* and J. He*, Nature Nanotechnology 2024, 19, 448–454.
    [8] C. Chen, Y. Yin, R. Zhang, Q. Yuan, Y. Xu, Y. Zhang, J. Chen, Y. Zhang, C. Li, J. Wang, J. Li, L. Fei, Q. Yu, Z. Zhou, H. Zhang, R. Cheng, Z. Dong, X. Xu, A. Pan*, K. Zhang* and J. He*, Nature Materials 2023, 22, 717–724.
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Elena P. Ivanova
Professor
Royal Melbourne Institute of Technology University, Australia

Elena P. Ivanova is Distinguished Professor at Royal Melbourne Institute of Technology University (Melbourne). Elena received her Doctor of Philosophy from the Institute of Microbiology and Virology, Ukraine, Doctor of Science from the Pacific Institute of Bio-organic Chemistry, Russian Federation, Juris Doctorate from the University of Melbourne, Australia.

She worked as a Postdoctoral Fellow at the New Energy and Industrial Technology Development Organization (Japan), Visiting Researcher at the Center of Marine Biotechnology, University of Maryland (USA), Visiting Professor at Hokkaido University (Japan), Cambridge University (UK) and the Institut Charles, Sadron, CNRS (France). She joined Swinburne University of Technology in 2001 and moved to RMIT University in 2018.

Elena’s research focuses on the fundamental and applied fields of nanobiotechnology, design and fabrication of biomimetic antimicrobial surfaces. She published over 400 research papers and recipient of several international awards, including the Morrison Rogosa Award, American Society for Microbiology, UNESCO Biotechnology Fellowship, and the AIST Fellowship and Foreign Researcher Invitation Program of the Agency of Industrial Science and Technology, Japan, UNSW Eureka Prize for Scientific Research and others.

Shedding Light on the Interfaces of Biomimetic Nanostructured Surface

The emergence of antibiotic-resistant bacteria is leading to an increase in untreatable infections around the world. To address this, a new class of bactericidal materials is being developed. The periodic array of the nanopillars on the surface of Clanger cicada Psaltoda claripennis wings represents the first example of a new class of biomaterials that kill bacteria on contact based solely on physical surface structure.

We developed the first biophysical model based on the bactericidal action of cicada wings to provide fundamental understanding of the mechanisms behind phenomenon. As the bacterial cells adsorb onto these nanopillar structures, the cell membrane stretches in the regions suspended between the pillars. If the degree of stretching is sufficient, this will lead to cell rupture. Another type of mechano-responsive nanomaterials is represented by graphene and graphene-related materials. Theoretical modelling and simulations provide compelling evidence to the physical perturbation of cell membranes.

One more model explaining physical rupturing of bacterial cells derived from the ability of nanofeatures to deflect and rupture when in contact with attaching cells. We showed that the exceptionally high aspect ratio (100 – 3000) of vertically aligned carbon nanotubes (VACNTs) impart their extreme flexibility, which allows to enhance the energy being stored in CNTs as they bend in contact with the bacteria. This work highlighted that the high bactericidal activity of high aspect ratio nanofeatures can outperform both natural bactericidal surfaces and other synthetic nanostructured multifunctional surfaces reported in previous studies.

The outcomes of our research provide evidence that the mechano-bactericidal activity of biomimetic nanostructured biomaterials with superior biocidal performance is a complex task requiring a multidisciplinary approach. The precision-engineered surface topographies to maximise microbial distraction is critical in the design and development of next-generation of antibacterial, antifungal and antiviral materials.

Deep Jariwala
Professor
University of Pennsylvania, USA

Deep Jariwala is currently an Associate Professor (promoted in 2022) and Peter & Susanne Armstrong Distinguished Scholar in the Department of Electrical and Systems Engineering at the University of Pennsylvania, with a courtesy appointment in the Department of Materials Science and Engineering. He leads the Device Research and Engineering Laboratory. He received his B.Tech. in Metallurgical Engineering from the Indian Institute of Technology (BHU), Varanasi in 2010 and his Ph.D. in Materials Science and Engineering from Northwestern University in 2015 (advisors: Mark C. Hersam and Tobin J. Marks), followed by postdoctoral research at the California Institute of Technology from 2015 to 2017 (with Harry A. Atwater). Professor Jariwala is an internationally renowned scholar in two-dimensional materials and nanoscale devices, with research spanning 2D semiconductor electronics, exciton photonics, ferroelectric memory, and low-power logic devices. He has published over 150 papers in journals including *Nature Materials* and *Nature Nanotechnology*, with more than 22,000 citations, and holds multiple U.S. patents. His honors include the 2024 Optica Adolph Lomb Medal, the 2022 Alfred P. Sloan Research Fellowship, the 2022 IEEE Photonics Society Young Investigator Award, the 2022 Bell Labs Prize ($100,000), and the 2017 Forbes 30 Under 30 in Science. He was elected an Optica Fellow in 2026 and serves as an Associate Editor for *Nano Letters*.

III-Nitride Ferroelectrics: From Materials to Technology Development

Since the demise of Dennard scaling, modern computer has largely relied on architectural innovations such as multi-core processors and GPUs vs CPUs to address the evolving needs of computing paradigm. This above problem has been exacerbated since computing has largely evolved from arithmetic centric to data centric in the age of billions of internet-connected devices and artificial intelligence. Thus, dense and reliable data storage combined with fast and high band-width access in novel memory devices has become the frontier for research in modern computing hardware. In this regard there have been several advancements across a variety of technologies in the past three decades. Ferroelectric materials and devices are among the forefront of these technologies due to their low-power and fast switching abilities but suffer from integration challenges. Simultaneously, developing data-heavy computing architectures in extreme environments is a growing need and a frontier challenge since silicon carbide (SiC) which is the leading logic technology for elevated temperature environments is limited by computing power and lack of memory devices that can operate at elevated temperatures.

Therefore, in this talk, I will try to make the case of how novel III-nitride materials might present interesting avenues to overcome some of the above limitations being faced by both Silicon and Silicon Carbide (SiC) hardware. I will start by presenting our ongoing and recent work on integration of 2D chalcogenide semiconductors emerging wurtzite structure ferroelectric nitride materials1 namely aluminium scandium nitride (AlScN). First, I will present on Ferroelectric Field Effect Transistors (FE-FETs) made from 2D materials when integrated with AlScN and make the case for 2D semiconductors in this application. I will then show our most recent results on scaling 2D/AlScN FE-FETs, achieving ultra-high carrier and current densities in ferroelectrically gated MoS2 and also demonstrate negative-capacitance FETs by engineering the AlScN/dielectric/2D interface.

Then, I will switch gears to introduce the ferroelectric diode (FeD) memory device and demonstrate multi-bit operation as well as compute in memory (CIM) using FeD devices made from AlScN. Finally, I will demonstrate why AlScN FeDs are uniquely suited as a high temperature non-volatile memory demonstrating stable operation upto 600 C and how AlScN can be integrated onto SiC for stable data retention in ferroelectric capacitors upto 1000 C.I will end by providing a broad outlook on both AI computing hardware as well as high-temperature computing.

Dae-Hyeong Kim
Professor
Seoul National University, South Korea

Dae-Hyeong Kim obtained his B.S. and M.S. degree in Chemical Engineering from Seoul National University, Korea, in 2000 and 2002, respectively. He received his Ph. D. degree in Materials Science and Engineering from University of Illinois at Urbana Champaign in 2009. From 2009 to 2011, he was a post-doctoral research associate at University of Illinois. He joined Seoul National University in 2011 and is currently a professor in School of Chemical and Biological Engineering of Seoul National University. He has been serving as an associate director of Center for Nanoparticle Research of Institute for Basic Science (IBS) from 2017. He has been focusing on the research of nanomaterials-based bio-integrated and bio-inspired electronics. He is a fellow of National Academy of Engineering of Korea (2026-present) and Fellow of American Institute of Medical and Biological Engineering (2025-present). He has been recognized with several awards including George Smith Award (2009), TR 35 award (2011), Hong Jin-ki Creative Award (2015), SCEJ Award (2016), Korea Young Scientist Award (2017), and Prime Minister Commendation of Ministry of Science and ICT of Korea (2023). He has been recognized as a highly cited researcher by Clarivate Analytics in 2018-2025. He has served as the editors and editorial board members in multiple journals, including the Deputy Editor of Science Advances (2025-present).

Robust Power Supply for Soft Implantable Bioelectronics

Recent advances in soft bioelectronics have attracted considerable attention due to their potential applications in personalized, bio-integrated healthcare systems. A primary challenge in this field arises from the mechanical mismatch between conventional rigid electronic devices and the soft, dynamic nature of human organs. To address this challenge, novel materials for soft, stretchable electronic devices have been developed, offering mechanical and chemical properties more compatible with in vivo cellular environments. Despite these advances, current stretchable conductive materials typically exhibit lower conductivity than commercial implantable devices, which leads to higher power consumption and more frequent battery replacement. This talk introduces a sustainable power supply solution for soft implantable bioelectronics to overcome these limitations. An all-solid-state thin-film lithium-ion battery, combined with parity-time symmetric long-range wireless power transfer, represents a promising approach. This system eliminates the need for periodic battery replacement, thereby significantly reducing the physical and economic burdens on patients. Key technological challenges and future research directions will also be briefly discussed. Ongoing efforts in developing unconventional materials and bioelectronic systems are expected to have a profound impact on addressing unmet needs in clinical medicine.

Guilhem Larrieu
Research Director
LAAS-CNRS, France

Guilhem Larrieu is Director of Research at CNRS, working at LAAS-CNRS laboratory in Toulouse (France) and Research Fellow at the University of Tokyo (Japan). He is leading an activity on Nano-&Neuro-Electronics (NNE lab) aiming at developing advanced devices based on functional nanostructures for ultimate nanoelectronics (logic & memory applications) and for innovative biosensor platforms in particular for neural interfacing. Guilhem Larrieu received a Ph.D. degree in Electronics in 2004 (Univ. Lille), then obtained a post-doctoral fellowship at the University of Texas at Arlington (UTA). In late 2005, he secured an independent researcher position at IEMN-CNRS laboratory in Lille on MOS transistor technology. In 2010 he moved to LAAS-CNRS to establish a new research axis on vertical nanowire based-devices. From 2019-2021, he was an Invited Researcher at the University of Tokyo to extend its nanoelectrode concepts to interface with high resolution human organoids. He has co-authored +100 publications in peer reviewed journals and 15 patents. He has served on Conference Committees of IEEE IEDM, IEEE ESSERC, IEEE NMDC, DATE, E-MRS and expert for several international funding agencies.

Nanotechnology for Deciphering Brain Function on Chip: High-Resolution Neural Interfaces with Nanoelectrode Arrays

Understanding brain function requires technologies capable of probing neural activity at the spatial scale of synaptic integration and the temporal scale of electrophysiological signalling. However, conventional electrophysiological and optical techniques remain limited in their ability to access subcellular dynamics and to provide stable, long-term measurements in complex neural tissues. In this keynote, we present nanoelectrode array (NEA) technology as a promising platform for brain-on-chip systems. Using three-dimensional nanostructured electrodes with well-controlled electrochemical interfaces, NEAs allow dense, label-free electrical recordings with improved coupling to neurons. This makes it possible to access signals at the level of subcellular compartments and to better study network dynamics in advanced in vitro models such as brain organoids. Because the interface is bidirectional, it can be used both for high-resolution recording and for precise stimulation of subcellular elements, with good efficiency. We highlight recent advances in the fabrication and integration of large-scale NEA platforms, in particular their monolithic integration onto CMOS circuitry, as well as their combination with chemical sensors for multiplexed analysis. We also show that these systems can provide high-resolution and stable recordings over long periods, even across extended neural tissues. Altogether, this positions NEAs as a practical link between nanoelectronics and neuroscience, making it possible to study functional connectivity and signal propagation in three-dimensional neural systems in more detail. As a perspective, we will briefly discuss the move toward biohybrid systems, where nanoelectronic interfaces are combined with living neural networks within the same platform, opening new ways to study brain function and explore neuro-inspired approaches.

John H Lau
Dr.
Unimicron Technology Corporation

John H Lau, with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 are the principal investigator), 52 issued and pending US patents (31 are the principal inventor), and 23 textbooks. John is an elected IEEE fellow, IMAPS Fellow, and ASME Fellow and has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.

Chiplets and Heterogeneous Integration

Chiplet is a chip design method while heterogeneous integration is a chip packaging method. They are different but they work together. The advantages and disadvantages of chiplets will be discussed. The communications (bridges) between chiplets such as those embedded in build-up package substrate and those embedded in fan-out epoxy molding compound will be presented. Cu-Cu hybrid bonding bridges between chiplets will also be examined. Chiplets heterogeneous integration for high-performance computing driven by artificial intelligence on TSV (through-silicon via) interposer vs. on TGV (through-glass via) interposer (3.3D and 3.5D IC integration) will be examined. Some recommendations will also be provided.

James E. Morris
Professor
Portland State University, USA

Jim is an ECE Professor Emeritus at Portland State University (PSU), Oregon, and an IEEE Life Fellow, and has served as EE/ECE Department Chair at both SUNY-Binghamton and PSU. He has B.Sc. (1965) and M.Sc.(hons) degrees (1967) in Physics from the University of Auckland, a Ph.D. in EE (1971) from the University of Saskatchewan, and the Doctor Honoris Causa degree (2015) from Bucharest Polytechnic University. Jim has served the IEEE Electronics Packaging Society (EPS) and Nanotechnology Council (NTC) in multiple roles since 1991 and 2008 respectively, including as NTC President (2020-2021) and General Chair of 6 international conferences. His research interests have ranged from isotropic conductive adhesives, nanopackaging, nanoelectronics simulation, and discontinuous thin metal films to automotive engine control. Jim has taught continuously for over 60 years and published 10 books, 63 journal papers, 107 refereed conference papers, 33 book chapters, and one patent, plus >80 other conference presentations.

Pseudo-Inductance and Electron Hopping in Discontinuous Metal Thin Films

When a metal is deposited on insulating substrate, e.g., Au on glass in vacuo, it initially grows as discrete nanoscale metal islands separated by nm gaps. Such films conduct charge by interisland tunnelling with an electrostatic activation energy [1-3]. The presentation will briefly cover the widely accepted conduction model [1, 2] and a revised contact injection version [3-5], which explains most of the former’s problems, as an introduction. Early research papers mentioned the possibility of electron hopping [6,7] but were given scant attention. The experimental discrepancies with accepted conduction models led to the contact injection model [3-5] and the so-called “diode effect” due to unequal positive and negative charge injection [3-5, 8-10]. The time delay required to establish the space charge distributions at the contacts leads to a pseudo-inductance analogous to the RTD quantum inductance [3,4]. These effects are made more apparent with the fabrication of asymmetric contact structures and the appearance of electron hopping [8,11]. The paper will derive an expression for the pseudo-inductance and present evidence of electron hopping at extreme asymmetries.

References
[1]C.A. Neugebauer & M.B. Webb “Electrical Conduction Mechanism in Ultrathin, Evaporated Metal Films” J Appl Phys 33 (1962) 74-82.
[2]J.E. Morris & T. J. Coutts “Electrical Conduction in Discontinuous Metal Films; A Discussion” Thin Solid Films 47 (1977) 3-65.
[3]J.E. Morris “Electron Transport in Discontinuous Metal Thin Films” Nano Express 3 014002, open access, (2022). doi:10.1088/2632-959X/ac550c
[4]F. Wu & J.E. Morris “Modeling Conduction in Asymmetrical Discontinuous Thin Metal Films,” Thin Solid Films 317 (1998) 178-182.
[5]J.E. Morris “Recent Progress in Discontinuous Thin Metal Film Devices” Vacuum 50(1-2) May/June (1998) 107-113.
[6]P.A. Tick & F.P. Fehlner “Electrical Behavior of Composite Discontinuous Films” J Appl Phys 43 (1972) 362-368.
[7]B.W. Licznerski “An A.C. Equivalent Circuit for Thin Discontinuous Metal Films” Thin Solid Films 55 (1978) 361-374.
[8]J.E. Morris & W.-K. Chiu “Pseudo Inductive Effects and Electron Hopping in Discontinuous Metal Thin Films” in Proc. 31st Natl. Sympos. AVS, Reno, NV, Dec. 1984; J. Vac. Sci. Technol., 3(3) (1985).
[9]P.G. Borziak, V. Dyukov, A. Kostenko, Yu. Kulyupin & S. Nepijko “Electrical Conductivity in Structurally Inhomogeneous Discontinuous Metal Films” Thin Solid Films, 36 (1976) 21-24.
[10]S.A. Nepijko, D. Kutnyakhov, S.I. Protsenko, L.V. Odnodvorets & G. Schonhense “Sensor and Microelectronic Elements Based on Nanoscale Granular Systems” J. Nanopart. Res., Art. no. 13:6263-6281, (2011). doi: 10.1007/s11051-011-0560-3.
[11]J.E. Morris “AC Effects in Asymmetric Discontinuous Metal Films” Thin Solid Films 193/194 (1990) 110-116.

Tianling Ren
Professor
Tsinghua University, China

Ren Tian-Ling is a Professor at the School of Integrated Circuits, Tsinghua University. He serves as Vice Dean of the School of Information Science and Technology. Professor Ren’s research team has long been dedicated to the study of intelligent micro-nano electronic devices, chips, and systems, covering intelligent sensors and intelligent integrated systems, two-dimensional nanoelectronic devices and chips, flexible wearable devices, chips and systems. They have published over 900 papers in domestic and international academic journals and conferences, including papers in important SCI-indexed journals such as Nature, Nature Electronics, Nature Machine Intelligence, as well as IEDM conference papers. Prof. Ren has been recognized as a “Highly Cited Chinese Researcher” for 8 years by Elsevier. His work has received over 30,000 citations on Google Scholar, and have been granted more than 200 domestic and international invention patents.

Novel Integrated Device Technologies Driving Moore’s Law

Conventional silicon technologies now facing several physical limits. This keynote discusses how integrated device technologies can both extend Moore’s Law and go beyond Moore’s Law. The first part contains two subsections. The sub-nanometer gate-length transistors based on graphene and MoS2, including a vertical-channel transistor with a 0.34 nm gate length. And the flexible in-memory computing chips, where memory and computation are integrated on mechanically compliant substrates to reduce data movement and support edge intelligence. The second part contains two beyond-Moore examples. One is intelligent artificial throat enabled by graphene acoustic devices, skin-compatible sensing, and speech recognition with semantic output. Another is a human-integrated dynamic 12-lead ECG system enabled by graphene electronic skin, flexible interconnects, and local AI processing for continuous cardiovascular monitoring. Together, these examples show that the new driving force can support smaller devices, flexible edge computing, and human-centered intelligent systems.

Federico Rosei
Professor
University of Trieste, Italy

Prof. Federico Rosei is Chair of Industrial Chemistry at the University of Trieste. Previously Professor and Director at INRS, Canada, he also held the Canada Research Chair and UNESCO Chair in energy-related materials. With 533 papers in Science, Nature Materials, Nature Photonics, and Angewandte Chemie (30,800 citations, H=91), he has delivered more than 380 invited talks worldwide and is a Fellow of the Royal Society of Canada, Academia Europaea, Australian Academy of Technology and Engineering, APS, and MRS. His distinctions include the Blaise Pascal Medal, Prix Marie-Victorin, Guggenheim Fellowship, and Nano Energy Award.

Energy Challenges from the Materials Perspective

The quest for sustainable development dictates an urgent transition from fossil fuels to renewables. This presentation focuses on next generation (solar) energy technologies from a materials perspective. We study structure property/relationships in advanced materials, emphasizing multifunctional systems that exhibit several functionalities. Such systems are then used as building blocks for the fabrication of various emerging technologies. In particular, nanostructured materials synthesized via the bottom–up approach present an opportunity for future generation low cost and low energy intensive manufacturing of devices. We focus on recent developments in solar technologies, including third generation photovoltaics, solar hydrogen production, luminescent solar concentrators and other optoelectronic devices, highlighting the role and importance of critical raw materials.

Oliver Schmidt
Professor
Chemnitz University of Technology, Germany

Professor Oliver G. Schmidt is the Scientific Director of the Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) and holds the Chair of Material Systems for Nanoelectronics at the Chemnitz University of Technology, Germany. He is Adjunct Professor of Nanophysics at Dresden University of Technology, Germany and Honorable Professor at both Fudan University and Changzhou University. He is an elected member of the German Academy of Science and Engineering and has co-founded the International Institute for Intelligent Nanorobots and Nanosystems at Fudan University. He received numerous international prizes and awards: Among them the Otto-Hahn Medal from the Max-Planck-Society in 2000, the Philip-Morris Research Award in 2002, the Carus-Medal from the German Academy of Natural Scientists Leopoldina in 2005, the International Dresden Barkhausen Award in 2013, the Gottfried Wilhelm Leibniz-Prize of the German Research Foundation in 2018, and an Advanced Grant of the European Research Council (ERC) in 2019. He is a pioneer in micromachining microrobotics, their biomedical applications and their potential for creating artificial life. He has made major scientific contributions to small scale energy storage devices, flexible electronics and 3D integrated microsystems. He has authored and co-authored > 900 papers with a citation index > 69.000 and an H-index of 135.

Assembly and Self-Assembly of Autonomous Microrobots – Following Nature’s Principles

Analogous to nature with its biological cells as self-assembled building blocks for myriads of differently programmed lifeforms, tiny modular microrobots make large leaps forward towards creating artificial life based on non-biologically assembled material modules [1].
The talk will show how the field has developed from tiny magnetic – yet increasingly more complex – remotely controlled actuator devices [2] to mass fabricated modular microrobots with on-board electronic control [3,4]. They are assembled form soft material scaffolds and tiny Si CMOS chiplets sitting between the folds, for a massive increase in information processing capabilities. They can communicate, dock together and self-assemble into larger entities like simple forms of non-biological organsims.
The technology is based on our previous work on self-folding [5,6] and self-locomoting [7] thin film electronic modules and addresses key challenges in the field of microrobotics, for instance on-board energy management [8,9] and the question of whether body or brain should come first when constructing microrobotic systems [10].
References
[1] J. S. McCaskill, D. Karnaushenko, M. Zhu, O. G. Schmidt, Adv. Mater. 35, 2306344 (2023)
[2] H. Xu, S. Wu, Y. Liu, X. Wang, A. K. Efremov, L. Wang, J. S. McCaskill, M. Medina-Sánchez, O. G. Schmidt, Nature Nanotechnol. 19, 494 (2024)
[3] Y. Lee, V. K. Bandari, J. S. McCaskill, P. Adluri, D. Karnaushenko, D. D. Karnaushenko, O. G. Schmidt, Sci. Robot. 10, eadu6007 (2025)
[4] V. K. Bandari, Y. Lee, P. Adluri, D. Karnaushenko, D. D. Karnaushenko, J. S. McCaskill, O. G. Schmidt, Adv. Intell. Syst. https://doi.org/10.48550/arXiv.2508.17390
[5] C. Becker, B. Bao, D. D. Karnaushenko, V. K. Bandari, B. Rivkin, Z. Li, M. Faghih, D. Karnaushenko, O. G. Schmidt, Nature Comm. 13, 2121 (2022)
[6] L. Merces, L. M. Minatogau Ferro, A. Thomas, D. D. Karnaushenko, Y. Luo, A. I. Egunov, W. Zhang, V. K. Bandari, Y. Lee, J. S. McCaskill, M. Zhu, O. G. Schmidt, D. Karnaushenko, Adv. Mater. 36, 2313327 (2024)
[7] V. K. Bandari, Y. Nan, D. Karnaushenko, Y. Hong, B. Sun, F. Striggow, D. D. Karnaushenko, C. Becker, M. Faghih, M. Medina-Sanchez, F. Zhu, O. G. Schmidt, Nature Electron. 3, 172 (2020)
[8] M. Zhu, O. G. Schmidt, Nature 589, 195 (2021)
[9] J. S. McCaskill, V. K. Bandari, S. Schmidt, O. G. Schmidt, Nature Rev. Mater. 11, 393 (2026)
[10] O. G. Schmidt, V. K. Bandari, J. S. McCaskill, Nature Electron. 9, 2 (2026)

Georgios Ch. Sirakoulis
Professor
Democritus University of Thrace, Greece

Georgios Ch. Sirakoulis received the M.Eng. Diploma as well as the Ph.D. Diploma of Electrical and Computer Engineering from the Department of Electrical and Computer Engineering of the Democritus University of Thrace, in 1996 and 2001, respectively; he is Professor in the Department of Electrical and Computer Engineering since 2018 and served as chair for the period 2020-2025. In addition, he has been a visiting researcher / professor at UWE, UK since 2014 and prior to his academic appointment, he has worked in the private sector as a co-founder and research associate of Ulysses Ltd. (1999-2002). He is author(co-author) of more than 190 peer reviewed articles in prestigious international scientific journals and more than 200 peer reviewed articles in proceedings of international scientific conferences. He has co-authored and co-edited 10 scientific books and is the author of 42 chapters in international scientific books. He is EiC of IEEE Trans. on Nanotechnology, and he is serving and serves an Associate Editor in well-known magazines in the field of nanotechnology, circuits and systems, such as, IEEE Nanotechnology Magazine, IEEE AgriFood Electronics, IEEE TCAS II, IEEE Trans. on Computer, Plos One, Microelectronics, Integration, JCA, IJUC, IJPDS, etc. and is an elected member of many international and national scientific associations. He has supervised and he is supervising 21 Doctoral Dissertations, 41 Postgraduate Theses and 105 Diploma Theses, while some of the above dissertations and theses have been awarded by the Department, and by domestic and international bodies. Prof. G. Sirakoulis has worked as a Coordinator, Principal Investigator or Scientific Officer/Researcher in more than 30 research projects funded by GSRT, the European Union, HFRI, as well as by institutions and private companies in Greece and abroad, in research topics related to nanoelectronics and nanotechnology, future and emergent electronic-nanoelectronic devices, circuits and architecture, novel computational architecture, applications of complex and intelligent electronic systems in robotics, energy, etc. He has organized many international conferences and workshops, such as IEEE NMDC 2026, IEEE ICECS 2026, IEEE NMDC 2025, IEEE CAFÉ 2024, IEEE CNNA 2023, NANOARCH 2019, NANOARCH 2018, PACET 2017, etc. and has delivered invited talks at more than 40 international conferences, workshops and universities abroad in the last five years. More information on his research interests, published papers, research projects and international and domestic collaborations can be found on his website, and, in particular, on his personal page (http://gsirak.ee.duth.gr).

Engineered Living Materials: Challenges and Perspectives

Engineered Living Materials (ELMs) are an emerging class of materials that combine the self-healing, regenerative, and adaptive characteristics of biological systems with the structural integrity and versatility of traditional materials science. This interdisciplinary field utilizes the dynamic properties of living organisms to create materials that are robust, reliable, and capable of evolving in response to environmental changes through chemical communication, nutrient uptake, and ion exchange. Mycelium, the vegetative part of fungi, is a noticeable choice among ELMs due to its rapid growth, sustainability, and ubiquity in nature. In this talk, we are going to explore the challenges and perspectives of the hardware representation of ELMs. The proposed talk offers a scalable pathway from material modeling to hardware realization, advancing digital twin approaches for engineered living materials while also paving the way for the integration of biological feedback, real-time control, and non-linear electrical characteristics using memristive devices, circuits, and architectures appropriate for neuromorphic and bio-hybrid computing architectures.

Engineered Living Materials (ELMs) combine the self-healing, regenerative, and adaptive properties of biological systems with standard materials’ structural integrity and adaptability. This interdisciplinary field uses live living organisms’ dynamic properties to develop materials that are robust, reliable, and capable of evolving in response to environmental changes through chemical communication, nutrient uptake, and ion exchange. Mycelium, the vegetative half of fungi, is a popular choice among ELMs due to its quick growth, sustainability, and widespread distribution in nature. In this discussion, we will look at the challenges and perspectives of hardware representation of ELMs. The proposed talk provides a scalable pathway from material modeling to hardware realization, advancing digital twin approaches for engineered living materials while also paving the way for the integration of biological feedback, real-time control, and non-linear electrical characteristics using memristive devices, circuits, and architectures appropriate for neuromorphic and bio-hybrid computing architectures.

Jianpu Wang
Professor
Nantong University, China

Jianpu Wang has been a professor and president at Nantong University since 2025, has also held the position of professor at Nanjing Tech University since 2013. He has been awarded the National Science Fund for Distinguished Young Scholars (2017) and selected as Changjiang Scholar (2018). His research interests are organic/perovskite semiconductor devices and device physics, aiming for display and energy applications. He worked as a research engineer at Samsung Electronics in South Korea from 2003 to 2006, developing OLED displays using ink-jet printing technology. From 2006 to 2009, he carried out his Ph.D. studies on organic semiconductor/inorganic nanocrystal devices at Cavendish Laboratory, University of Cambridge. He was then a postdoctoral research associate studying organic magnetic field effect at Cavendish from 2009 to 2013.

Perovskite LEDs for Lighting and Displays

Solution-processed light-emitting diodes (LEDs) are attractive for applications in low-cost, large-area lighting sources and displays. Metal halide perovskites can be processed from solutions at low temperatures to form crystalline direct-bandgap semiconductors with intriguing optoelectronic properties, such as high photoluminescence yield, good charge mobility and excellent color purity. In this talk, I will present our effort to boost the efficiency of perovskite LEDs to a high level which is comparable to organic LEDs.[1-8] More importantly, organic LEDs are difficult to maintain high efficiency at high current densities due to their excitonic nature and low charge mobilities. Low temperature solution-processed perovskite LEDs demonstrate remarkably high efficiency at high current densities, suggesting unique potential to achieve large size planar LEDs with high efficiency at high brightness.
References
[1] Wang, J. et al. Interfacial Control Toward Efficient and Low-Voltage Perovskite Light-Emitting Diodes. Adv. Mater. 27 (2015) 2311.
[2] Wang, N. et al. Perovskite light-emitting diodes based on solution-processed self-organized multiple quantum wells. Nat. Photonics 10 (2016) 699.
[3] Cao, Y. et al. Perovskite light-emitting diodes based on spontaneously formed submicrometre-scale structures. Nature 562 (2018) 249.
[4] Zou, W. et al. Minimising efficiency roll-off in high-brightness perovskite light-emitting diodes. Nat. Commun. 9 (2018) 608.
[5] Min, H. et al. Additive treatment yields high-performance lead-free perovskite light-emitting diodes. Nat. Photonics 17 (2023) 755.
[6] Min, H. et al. Spin coating epitaxial heterodimensional tin perovskites for light-emitting diodes. Nat. Nanotechnol. 19 (2024) 632.
[7] Li, M. et al. Acceleration of radiative recombination for efficient perovskite LEDs. Nature 630 (2024) 631.
[8] Ke, Y. et al. High-performance tandem perovskite LEDs through interlayer photon recycling. Nature 631 (2026) 53.

Winnie Ye
Professor
Carleton University, Canada

Winnie Ye is a Fellow of Optica, the Canadian Academy of Engineering (CAE), and the Engineering Institute of Canada (EIC), and a Full Professor in Electronics at Carleton University. Her research focuses on silicon photonics and integrated optoelectronic devices for telecommunications, data communications, biophotonics, and renewable energy. She held a Tier II Canada Research Chair in Nano-scale IC Design for Reliable Opto-Electronics and Sensors (2009–2021).
Dr. Ye earned her B.Eng. from Carleton and her M.A.Sc. and Ph.D. from the University of Toronto and Carleton. She was an NSERC Postdoctoral Fellow at MIT and Harvard University. She has received major leadership awards from Optica and IEEE and currently serves as Chair of IEEE Women in Engineering and member of Board of Governor of the IEEE Photonics Society.

Subwavelength Metamaterial Grating Couplers as Enablers for High-Performance Optical Communication Interfaces

Efficient fiber–chip interfaces are a foundational requirement for scalable photonic integrated circuits (PICs) in optical communication systems. Grating couplers are widely used for this purpose because their surface-normal coupling geometry supports wafer-level testing and relaxed packaging constraints. Despite these advantages, conventional grating couplers often suffer from limited efficiency, narrow operational bandwidth, polarization sensitivity, and vulnerability to fabrication variations, all of which restrict their deployment in high-performance communication links.

Subwavelength metamaterial grating couplers overcome these limitations by employing periodic features smaller than the wavelength to create an engineered effective medium. This approach enables precise control of the effective refractive index within the grating region, allowing smoother modal transitions between on-chip waveguides and radiated fields. As a result, metamaterial gratings exhibit improved upward radiation efficiency, reduced back-reflection, and increased tolerance to dimensional non-uniformities—key advantages for communication-grade devices.

A major strength of subwavelength designs lies in their ability to address polarization dependence. By tailoring duty cycles and trench geometries, effective indices for transverse-electric and transverse-magnetic modes can be balanced, enabling polarization-independent or polarization-flexible operation. Further performance gains are achieved through metamaterial apodization, in which subwavelength parameters vary along the propagation and transverse directions to shape the emitted field and improve overlap with standard Gaussian fiber modes. Single-etch metamaterial designs, as well as hybrid approaches incorporating overlays or self-focusing geometries, enable compact footprints while maintaining high efficiency and fabrication simplicity. Beyond fiber coupling, subwavelength metamaterial concepts extend naturally to on-chip optical antennas for free-space communication. By controlling the near-field phase distribution, these structures enable tailored far-field radiation patterns, including broadened beams and polarization-insensitive emission, opening opportunities for optical phased arrays, chip-to-free-space links, and hybrid photonic–wireless systems.

Overall, recent advances in subwavelength metamaterial grating couplers demonstrate a versatile and scalable platform that simultaneously delivers high efficiency, broadband operation, polarization robustness, and compact integration. These attributes position metamaterial grating couplers as key enabling components for next-generation silicon photonics and advanced optical communication architectures.

John Yeow
Professor
University of Waterloo, Canada

John T. W. Yeow received the B.A.Sc. degree in electrical and computer engineering, and M.A.Sc. and PhD. degrees in mechanical and industrial engineering from the University of Toronto, Toronto, ON, Canada. He is currently a Professor and a University Research Chair in the Department of Systems Design Engineering at the University of Waterloo, Waterloo, ON, Canada. He is focused on the development of micro/nanodevices for a wide range of applications. He is a recipient of the Professional Engineers Ontario Young Engineer Medal, Professional Engineers Ontario Engineering Excellence Award, Natural Science & Engineering Research Canada Innovation Challenge Award, Douglas R. Colton’s Medal of Research Excellence, Micralyne Microsystems Design Award, Ontario Ministry of Research and Innovation’s Early Researcher Award, University of Toronto Alumni Association 7T6 Early Career Award, 2011 IEEE NANO Excellence Paper award, Waterloo Institute for Nanotechnology Research Leader Award, and IEEE Canada Outstanding Engineer Award. He was a Canada Research Chair in Micro/Nanodevices (2009 – 2019). He served as the Editor-in-Chief of the IEEE Nanotechnology Magazine from 2014 – 2019. He is currently a Senior Editor of Microsystems & Nanoengineering, IEEE Transactions on NanoBioscience, and IEEE Transactions on Nanotechnology. He is an IEEE Fellow, and Fellow of the Canadian Academy of Engineering, the Engineering Institute of Canada, Engineers Canada, and a Member of College of New Scholars, Artists and Scientists of the Royal Society of Canada. He was a IEEE Nanotechnology Technical Council (NTC) Distinguished Lecturer, and a recipient of the 2021 IEEE NTC Distinguished Service Award. He was the IEEE NTC Vice-President of Educational Activities (2020-2022), and is serving as the IEEE NTC Vice-President Elect of Conferences (2024 – 2026). He was the General Chair of IEEE NANO 2014 in Toronto, Canada.

The Development of Multi-Pixel Field Emission X-ray Devices

The first concept of multi-source Computed Tomography (CT) systems originated in the 1980s, and opened the way to innovative system concepts in X-ray and computed tomography. Multi-source CT systems offer promising opportunities in system performance. In addition, multi-source X-ray radiographic systems are widely studied, namely for X-ray stereographic imaging, X-ray tomosynthesis imaging, and inverse-geometry imaging. One significant benefit of the multi-source X-ray technology is the ability to fabricate the source array in various two-dimensional configurations. The more complicated distributive source topologies are designed to improve the sampling of projection data, to further improve both in-plane and depth imaging resolution within the constraints of the limited-angle acquisition of projection data. In multi-source systems, the X-ray sources are arranged in an array format, and each source is launched individually. However, current X-ray generators are not suited for these systems because of their large size, huge power requirement, and slow response. This talk will focus on the field emission X-ray technology that enables to the realization of multi-source CT systems.

Jianfeng Zang
Professor
Huazhong University of Science and Technology, China

Professor Jianfeng Zang is Huazhong Scholarship Chief Professor in Huazhong University of Science and Technology, Distinguished Professor of the Ministry of Education’s Changjiang Scholars Program. His research focuses on innovative medical devices enabled by intelligent soft materials for medical-engineering convergence. He has published over 90 papers in journals including Nature, Nature Biomedical Engineering, Nature Materials, and Science Robotics. He was elected as a Fellow of the Royal Society of Chemistry (FRSC). He has received the Scientist Medal of the Year from the International Association of Advanced Materials and the Second Prize of the Hubei Provincial Natural Science Award. His research achievements have been selected in several lists including “Chip 2024 Top Ten Advances in Chip Science in China”, “2024 Top Ten Advances in National Medical-Engineering Integration”, “2024 Top Ten Advances in Brain-Computer Interface in China”, “2024 Top Ten Scientific and Technological Advances in Hubei Province”.

Implantable Soft Acoustic Hydrogels for Ultrasound Sensors on Monitoring Physiological Signals

Recent advances in soft materials, robotics, and manufacturing technologies have inspired many innovations in biomedical engineering like wearable electronics, implantable sensors, and new intervention methods. Soft acoustic materials possess extraordinary acoustic properties for long-distance wireless sensing and communication without the addition of electronic components or metal electrodes. To address the grand challenges in understanding the interfaces between human and medical devices, I will show our recent progress in the development of the medical devices using soft acoustic materials. Examples will be involved in this talk include: metagel ultrasonic sensor for wireless monitoring of physiological signals like strain, pressure, temperature, pH. Achieving multimodal and decoupled physiological signals is beneficial for an intricate and precise depiction of bodily health. Besides, wireless sensor in the form of embedded ultrasonic soft sensors (EUSS) is integrated with miniature machine, magnetic actuators, to address sensing-actuation incompatibility, enabling precise robotic feedback control, drug dosing, and physiological monitoring in vivo.

Peng Zhou
Professor
Fudan University, China

Dr. Peng Zhou’s groundbreaking contributions lie in resolving the fundamental challenge of balancing high-speed and non-volatile charge storage in floating-gate transistors since their invention in 1967. This breakthrough led to the development of the 400-picosecond “PoX” flash memory and the “Changying” architecture integrated with CMOS. Additionally, he leveraged the atomic-layer semiconductor to develop the “WUJI” RISC-V microprocessor, pioneered the innovative “all-in-one” transistor that integrates sensing, memory, and computing functions, and proposed the “QingNiao” system for the space satellites communication. These discoveries have established an independent intellectual framework and solidified his international academic leadership. This series of achievements marks a critical breakthrough in advancing atomic-layer semiconductors from fundamental physical devices to disruptive systems.

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Yanwu Zhu
Professor
University of Science and Technology of China, China

Yanwu Zhu is a Professor and PhD Supervisor in the Department of Materials Science and Engineering at the University of Science and Technology of China. He received his Bachelor’s degree from National University of Defense Technology, Master’s degree from Peking University, and PhD from the National University of Singapore, and has conducted postdoctoral research at the National University of Singapore and the University of Texas at Austin. He has long been engaged in the research of preparation and interface construction of novel carbon materials, and has made innovative achievements in the fields of graphene activation, artificial carbon crystal construction and large-scale preparation of carbon materials. He has published more than 130 papers in top journals such as Science, Nature and Advanced Materials, with over 28,000 citations. He was supported by the Excellent Youth Fund of the National Natural Science Foundation of China, and won many awards such as the SCOPUS Young Science Star Bronze Award and the APEC Science Award for Innovation, Research and Education, and was selected into the Elsevier Highly Cited Chinese Materials Scientists List and Clarivate Highly Cited Scientists List for many consecutive years.

Precision Construction and Functional Exploration of Novel Artificial Carbon Crystals at the Atomic Scale

Novel carbon materials are the core research direction of nano-material engineering, and the precise regulation of carbon crystal structure is the key to exploring new properties and applications. This report focuses on the charge injection technology developed for the structural regulation of fullerene C60 molecular crystals, which successfully constructs long-range ordered porous carbon crystals under atmospheric pressure and realizes gram-level preparation. It also expounds the universal value of this technology in atomic-level precision regulation of crystal structures, and discusses the potential application prospects of novel carbon crystals in energy storage, ion sieving and catalytic loading, as well as the development trend of carbon material system construction.